In fact, FPC is not only a circuit board that can be flexed, but also an important design method for connecting circuit structures. This structure can be used with other electronic product designs to build a variety of different applications. Therefore, from this point on, Look, FPC is very different from hard board.
For a rigid board, unless the circuit is made into a three-dimensional form by way of potting glue, the circuit board is generally flat in the general situation. Therefore, to make full use of the three-dimensional space, FPC is a good solution. In terms of hard boards, the current common space extension scheme is to use slots and interface cards, but FPC can make similar structures as long as it is a transfer design, and it is more flexible in directional design. With one piece of connection FPC, two pieces of hard board can be connected into a set of parallel circuit systems, or can be turned into any angle to adapt to different product shape designs.
Of course, FPC can use terminal connection for line connection, but also can use soft and hard boards to avoid these connection mechanisms. A single FPC can use layout to configure many hard boards and connect them. This approach reduces connector and terminal interference, which can improve signal quality and product reliability. The figure shows multiple hard boards and soft and hard boards based on FPC architecture.
FPC can make the thinnest circuit board because of its material characteristics, and thinning is one of the most important demands of the electronics industry at present. Because FPC is a thin film material for circuit production, it is also an important material for thin design in the future electronics industry. Because plastic materials have very poor heat transfer properties, thinner plastic substrates are more beneficial to heat dissipation. Generally, the gap between the thickness of the FPC and the rigid board is more than dozens of times, so the heat dissipation rate is also dozens of times. Flexible boards have such characteristics, so many of these high-wattage FPC assembly products are attached to metal plates to improve heat dissipation.
For FPC, one of the important features is that when the solder joint distance is close and the thermal stress is large, the stress damage between the contacts can be reduced due to the elastic nature of FPC. This advantage is especially so that some surface mounts can absorb their thermal stress, and this problem will be greatly reduced.